具有低热阻和寄生电感的PCB嵌入式SiC半桥封装单元的设计与分析

Reducing parasitic parameters and thermal resistance is critical for advancing power electronic devices. This article designs and evaluates the three printed circuit board (PCB) embedded 1200 V SiC mosfet half-bridge packaging cells, where the traditional wire bonding process is replaced by a redistribution layer (RDL) technique. A comprehensive evaluation of their electrical performance, thermal ...