面向正常与短时过流工况的功率模块双模热管理

Integrating phase change material (PCM) in a power module could mitigate the temperature surge during short-term overcurrent (OC). However, PCM in the path of heat conduction could impede cooling in normal operation. This article proposes a dual-mode thermal management approach for a three-dimensional loop packaging design of a half-bridge SiC mosfet power module, in which the PCM is placed away f...