一种基于气密性敷形涂层的250°C碳化硅功率模块高温封装方法

Featuring excellent material properties, silicon carbide (SiC) power devices emerge as the most promising candidates in high-temperature and high-power applications. However, existing silicone gel packaging techniques fail to meet the requirements for long-term reliable operations beyond 250 °C. To address this issue, this article proposes a hermetic conformal coating (HCC) packaging method. This ...