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GaN HEMT半桥故障瞬态的解析建模及其基于PCB嵌入式Rogowski线圈的过流保护
Analytical Modeling of Fault Transient in a GaN HEMT Half Bridge and Its Overcurrent Protection With PCB Embedded Rogowski Coils
| 作者 | P. T. Nandh Kishore · Sumit Kumar Pramanick · Soumya Shubhra Nag |
| 期刊 | IEEE Transactions on Industry Applications |
| 出版日期 | 2024年10月 |
| 技术分类 | 功率器件技术 |
| 技术标签 | GaN器件 可靠性分析 |
| 相关度评分 | ★★★★★ 5.0 / 5.0 |
| 关键词 | 氮化镓高电子迁移率晶体管 短路耐受时间 短路故障建模 过流保护 罗氏线圈 |
语言:
中文摘要
氮化镓高电子迁移率晶体管(GaN HEMT)的短路耐受时间(SCWT)较短,这对其可靠性提出了挑战,尤其在电动汽车充电器等中高功率应用中。本文基于电路中的状态变量和数据手册参数,对包含寄生元件的氮化镓高电子迁移率晶体管半桥结构中的短路故障瞬态进行建模。较高母线电压下的故障会导致瞬时功率损耗增加,进而使结温升高。这会导致器件的短路耐受时间缩短。该模型还用于估算不同直流母线电压下的故障清除时间。本文提出了一种用于氮化镓高电子迁移率晶体管的超快过流保护方案。该保护方案采用基于非侵入式印刷电路板嵌入式罗氏线圈(PCB - RC)的电流传感技术来检测器件电流。给出了直流母线电压设定为400 V时的实验结果,展示了器件在硬开关故障(HSF)情况下的保护情况。据报道,保护响应时间为38 ns,小于估算的故障清除时间。
English Abstract
The low Short Circuit Withstand Time (SCWT) offered by GaN HEMTs imposes challenges on their reliability, especially in medium to high power applications such as electric vehicle chargers. This article models the short circuit fault transient in a GaN HEMT half-bridge configuration including parasitic elements, based on the state-variables in the circuit and the datasheet parameters. Faults at higher bus voltages result in increased instantaneous power loss, which in turn lead to higher junction temperatures. This results in reduced SCWT for the device. The model is further used to estimate the fault clearing time for different dc bus voltages. A scheme for ultrafast over-current protection of GaN HEMTs is presented. The protection scheme employs a non-intrusive PCB-embedded Rogowski Coil (PCB-RC) based current sensing technique for sensing the device current. Experimental results with the dc bus voltage set to 400 V, demonstrating the protection of the device subjected to a hard switched fault (HSF) are presented. The protection response time is reported to be 38 ns, which is less than the estimated fault clearing time.
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SunView 深度解读
该研究对阳光电源的GaN器件应用具有重要参考价值。文中提出的PCB嵌入式Rogowski线圈过流保护方案可直接应用于ST系列储能变流器和SG系列光伏逆变器的GaN功率模块设计中,有助于提升产品可靠性。特别是在1500V高压系统中,纳秒级故障检测能力可有效防止GaN器件损坏。该技术也可优化车载OBC充电机的功率密度设计。建议在下一代产品中采用该保护方案,并结合iSolarCloud平台实现故障预警功能,进一步提升系统安全性与运维效率。