高功率密度功率模块的均匀高效嵌入式微流体冷却

The increasing power density of SiC power modules presents significant challenges in achieving uniform high-heat-flux thermal management, which is often limited by conventional packages. To address this, an embedded microfluidic-cooled SiC power module is developed, combining embedded microchannels and nano-silver sintering to enable efficient and uniform cooling. Microchannels were directly fabri...