一种集成液冷基板嵌入式碳化硅功率模块

To fully leverage the advantages of silicon carbide (SiC) power devices, this study presents a substrate-embedded SiC power module with integrated liquid cooling. Four 1.2-kV SiC mosfets are embedded in an organic substrate and cooled via a direct-bonded microchannel heatsink, within a packaging size of 20 mm × 20 mm × 2.4 mm. This design achieves short electrical interconnection with significantl...