基于陶瓷基板散热封装的SiC功率模块EMI抑制技术

This letter proposes the use of a chip-on-ceramic heatsink packaging to reduce common-mode (CM) noise at the package level while improving thermal performance for SiC power modules. The packaging directly attaches the SiC mosfets to a metallized AlN ceramic heatsink, reducing CM capacitive coupling between the switching node and ground, thereby decreasing CM noise. A 400 to 200 V dc–dc buck conver...