一种基于交错功率回路的超低寄生电感双面散热碳化硅功率模块

Higher switching speed requires power module package to have lower parasitic inductance. This article summarized three methods to realize low parasitic inductance. Based on these methods, this article proposed a novel double-sided cooling power module structure, which places the spacer under the bare die and utilizes the copper clips to realize the electrical connection between different copper la...