多芯片SiC MOSFET功率模块中用于电流平衡的源极电感优化铜夹片键合方法

Cu clip-bonding is a promising packaging method for lower resistance, lower inductance, and higher reliability than wire-bonding. Previous studies only simply replace bond wires with Cu clips on an individual die. However, current sharing and thermal coupling issues among multichip modules are still big challenges in the clip-bonded silicon carbide (SiC) mosfet power module. In this article, a nov...