高功率中高压WBG功率模块协同设计框架：3.3kV/200A线键合低电感SiC半桥模块案例研究

This paper proposed a co-design framework for high power high voltage wide bandgap (WBG) power module packaging that is generalized to reflect diverse design requirements across device technologies, packaging configurations, and voltage classes. Beyond the commonly addressed thermal, electrical, and mechanical multidisciplinary co-optimization, the proposed framework specially emphasizes considerations for medium/high voltage (MV/HV) designs, introduces the concept of Packaging and Assembly Process Development Kit (PA-PDK) and integrates “Design for Reliability (DfR)” in the development process for power module packaging. The effectiveness of the co-design framework is validated through case study with a 3.3 kV/200 A wire-bonded, low-inductance, silicon carbide (SiC) half-bridge module, which serves as a reference for the implementation of such co-design framework.