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电动汽车驱动 SiC器件 ★ 4.0

集成高K栅介质与分裂栅的4H-SiC超级结MOSFET

4H-SiC superjunction MOSFET with integrated high-K gate dielectric and split gate

语言:

中文摘要

本文提出一种集成高K(HK)栅介质与分裂栅(SG)的4H-SiC超级结MOSFET(HKSG-SJMOS)。该器件采用高K介质作为包围源极连接分裂栅与金属栅的栅介质,优化漂移区电场分布,形成低阻导电通道,提升击穿电压(BV)并降低比导通电阻(Ron,sp)。分裂栅结构结合高K介质有效减小栅-漏电容(Cgd)与栅-漏电荷(Qgd),改善开关特性。仿真结果表明,相较于传统器件,HKSG-SJMOS的优值(FOM=BV²/Ron,sp)提升110.5%,高频优值(Ron,sp·Cgd)降低93.6%,开通与关断损耗分别减少38.3%和31.6%,反向恢复性能亦更优。

English Abstract

A 4H-SiC superjunction(SJ)MOSFET(SJMOS)with integrated high-K gate dielectric and split gate(HKSG-SJMOS)is pro-posed in this paper.The key features of HKSG-SJMOS involve the utilization of high-K(HK)dielectric as the gate dielectric,which surrounds the source-connected split gate(SG)and metal gate.The high-K gate dielectric optimizes the electric field distri-bution within the drift region,creating a low-resistance conductive channel.This enhancement leads to an increase in the break-down voltage(BV)and a reduction in the specific on resistance(Ron,sp).The introduction of split gate surrounded by high-K dielectric reduces the gate-drain capacitance(Cgd)and gate-drain charge(Qgd),which improves the switching characteristics.The simulation results indicate that compared to conventional 4H-SiC SJMOS,the HKSG-SJMOS exhibits a 110.5%enhance-ment in figure of merit(FOM,FOM=BV2/Ron,sp),a 93.6%reduction in the high frequency figure of merit(HFFOM)of Ron,sp·Cgd,and reductions in turn-on loss(Eon)and turn-off loss(Eoff)by 38.3%and 31.6%,respectively.Furthermore,the reverse recovery characteristics of HKSG-SJMOS has also discussed,revealing superior performance compared to conventional 4H-SiC SJMOS.
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SunView 深度解读

该HKSG-SJMOS技术对阳光电源功率器件应用具有重要价值。其110.5%的FOM提升和93.6%的Ron,sp·Cgd降低,可直接应用于ST系列储能变流器和SG系列光伏逆变器的SiC功率模块设计,显著降低导通损耗和开关损耗(开通/关断损耗分别减少38.3%/31.6%)。高K介质与分裂栅结构有效减小Cgd和Qgd,可优化三电平拓扑的死区时间控制,提升系统效率。该技术特别适用于PowerTitan大型储能系统和车载OBC充电机等高频应用场景,改善的反向恢复特性可增强系统可靠性,为阳光电源下一代高功率密度产品提供器件级创新方向。