一种用于高温应用、低热应力的SiC功率模块双面冷却无键合线封装结构

To leverage the outstanding high-temperature resistance of silicon carbide (SiC), theoretically up to 500 °C, conventional packaging materials, and structures have become inadequate to meet the requirements. The double-sided cooling (DSC) package structure can eliminate power bond wires, which are the reliability weak points in the conventional package, and has low parasitic inductance and low the...