一种具有多维自感和互感的双面冷却多芯片功率模块综合设计方法

The double-sided cooling (DSC) packaging configuration, distinguished by its low loop inductance and superior thermal performance, presents a promising solution for multichip silicon carbide (SiC) modules. Nevertheless, challenges persist in the design aspects of current balancing and thermal coupling. This article proposes a comprehensive design method that utilizes the multidimensional self-and ...