具有层压铝/铜应力缓冲层的可靠铝线键合SiC/Si二极管

Operation temperature of typical wire-bonded power modules, especially for harder silicon carbide (SiC) power chips, keeps increasing. The thermo-mechanical reliability of aluminum (Al) wire-bonds which suffer from the mismatch of coefficient of thermal expansion (CTE) between chip and bonding wires reduces significantly. In this letter, a novel laminated Al/copper (Cu) soft stress buffer was prop...