宽禁带功率电子模块的3D棱柱封装方法

In a power module the parasitic inductance limits the dynamic high-frequency performance, and the area of the cooling surfaces limits the power capability. This article presents a new 3-D power electronic design methodology based on the concept of mutual inductance cancellation and multisided heat transfer. New 3-D prismatic packaging concepts are proposed for wide band gap power devices, where th...