一种采用烧结银中间层的双面冷却SiC MOSFET功率模块：设计、仿真、制造与性能表征

Planar, double-side cooled power modules are emerging in electric-drive inverters because of their low profile, better heat extraction, and lower package parasitic inductances. However, there is still a concern about their reliability due to the rigid interconnection between the device chips and two substrates of the power module. In this article, a porous interposer made of low-temperature sinter...