二维材料基场效应晶体管中的关键问题

Over the last 10 years, electronics made from ultra-thin materials have gone from lab curiosity to a serious contender for the next generation of chips and sensors. Engineers have begun to grow these sheets on full wafers, stack them like Lego blocks, and even add special layers to extend their functionality. The 20 contributions gathered in this _Applied Physics Letters_ Special Collection capture the field. They reveal how clever materials design can unlock new device physics while charting practical routes toward large-area manufacturability. Together, the papers highlight why a fresh look at interfaces, contacts, and functional layering is timely: industry roadmaps point to sub-1 nm technology nodes within a decade, neuromorphic computing urgently needs non-volatile synapses, and the Internet-of-Things demands sensors that run for a long time on harvested power.