基于瞬态液相键合的高温应用Cu@Sn核壳结构粉末预制件

This paper presents a novel die-attach material for high-temperature applications based on transient liquid phase (TLP) bonding. Cu particles are electroless plated with Sn to achieve Cu@Sn structure, and the fabricated Cu@Sn particles are compressed into preforms for die attachment. This material can be reflowed at a low temperature (<260 °C) due to the low melting temperature of the outer Sn lay...