用于电动汽车/混合动力汽车应用的功率器件封装技术：研究现状

Electric and hybrid electric vehicles (EVs/HEVs) rely on power modules for efficient energy conversions. The market is demanding more compact power modules to achieve higher power density. Recent advances in power chips—characterized by diminutive size, large current, high levels of integration, and the increasing use of wide bandgap (WBG) semiconductors, such as silicon carbide (SiC) devices—offer exciting possibilities for more compact and powerful modules. However, it’s crucial to reassess whether current packaging technologies can keep pace with these rapid chip advancements. This study presents the state-of-the-art power modules utilized in EV/HEV applications and their packaging technologies. We review the trends in power chip development, analyze the challenges these pose to packaging, and outline the features and improvements of recent packaging solutions. The goal is to provide a valuable resource for developing compact and high-power-density power modules.