中压功率模块陶瓷基板-硅凝胶界面电荷的时空测量

With the proliferation of high-voltage, high-power density devices, insulation failure has emerged as a latent hazard in power modules. Notably, breakdown along ceramic substrate–silicone gel interfaces is a typical insulation failure process in power modules, necessitating particular attention and elucidation. Specifically, the charge movement characteristics that play a pivotal role in the failu...