运行中SiC MOSFET键合线脱落事件的原位检测

Bond wire lift-off is one of the main failure mechanisms for silicon carbide mosfets. This occurs when the metallurgical weld between the bond-wire and the device source breaks creating an open circuit. The higher current on the remaining wires subjects them to additional thermal stress creating a positive feedback loop that can quickly lead to device failure if left unchecked. By detecting lift-o...