基于直接金属化技术的无DBC功率模块近结水冷研究：分析与实验对比

Reducing the thermal resistance is vital for power modules. Thermal conducting paths are formed by heterogeneous layers for insulation, causing inevitably high thermal resistance. In this article, with the aid of direct metallization technology, a direct bonded copper (DBC)-free power module concept is proposed to achieve near-junction water cooling. A 55% reduction of thermal resistance is achiev...