多芯片功率模块封装中中点电感对开关瞬态影响的分析与实验评估

Middle-point inductance ${{\boldsymbol L}_{{\boldsymbol {\text{middle}}}}}$ can be introduced in multiple-chip power module package designs. In this paper, the effect of middle-point inductance on switching transients is analyzed first using a frequency-domain analysis. Then a dedicated multiple-chip power module is fabricated with the capability of varying ${{\boldsymbol L}_{{\boldsymbol {\text{m...