通过加热抑制硅凝胶封装功率模块隔离沟道中的枝晶腐蚀

Environments with high humidity and corrosive gases have been shown to cause dendritic corrosion growth in the isolation trenches of power semiconductor modules. In time the dendrites can short the isolation trenches, causing failure of the component and the device. In this paper moderate heating is shown to effectively impede the dendrite growth in off-the-shelf silicone gel potted power modules.