用于电力电子封装的溅射纳米晶银薄膜低温直接键合：键合机理、热特性及可靠性

Nanocrystalline metal films are emerging as die-attach materials for power electronic packaging owing to their organic-free nature and capacity for low-temperature bonding. In this study, we proposed magnetron-sputtered nanocrystalline Ag (Nano-Ag) film as a die-attach material for power device packaging. Low-temperature direct bonding of Nano-Ag films was achieved at 200 °C in air, utilizing the ...