多芯片功率模块结壳级耦合热阻推导方法

A method to derive the junction-to-case level coupling thermal resistances among paralleling chips in the multichip semiconductor power module has been proposed in this article. It is revealed that the traditional structure function methodology (SFM), which is developed for analyzing the self-heating effect of the driving-point chip, cannot be applied directly in the thermal coupling analysis, whe...