利用低介电常数材料降低共模电磁干扰的功率半导体模块

The layout of a low-permittivity material is designed in a power semiconductor module to reduce parasitic common-mode (CM) capacitance and hence attenuate the CM current. Without sacrificing the thermal performance between the semiconductor devices and heat sink, a portion of the bottom copper of a direct-bond-copper substrate is replaced by air to decrease capacitance. The proposed power module i...