并联芯片与并联半桥对多芯片功率模块瞬态电流分布的影响

This letter addresses the transient current distribution in the multichip half-bridge power modules, where two types of paralleling connections with different current commutation mechanisms are considered: paralleling dies and paralleling half-bridges. It reveals that with paralleling dies, both the high-side and low-side paralleled devices experience a similar transient current imbalance due to t...