MOSFET功率电子模块的直接单喷射射流冷却

This paper presents an approach of direct liquid jet impingement cooling of a typical mosfet power module. A single micro water jet was installed for cooling the upper surface of a mosfet semiconductor package. In contrast to standard cooling methods, this approach focuses on hot spot removal omitting any kind of heat spreading device. The cooling chamber was directly soldered to the mosfet cover ...