通过嵌入式封装结构降低大功率LED芯片键合界面热阻

Thermal management is a key issue for high-power light-emitting diodes (LEDs). In this study, a novel packaging structure was proposed to reduce the die-bonding interface thermal resistance and provided a new idea for LED heat-dissipation. The LED chip was embedded into a square groove at the lead-frame substrate. The gap between the edges of the LED chip and square groove was filled with boron ni...