一种用于紧凑型DC-DC变换器晶圆级集成的硅基高Q值功率电感

This paper reports the design, fabrication, and characterization of a novel power inductor embedded inside a silicon substrate and fabricated at wafer level. Such power inductors in silicon (PIiS) employ high-aspect ratio silicon molds formed with deep-reactive ion etching to obtain large cross-sectional electroplated copper windings (as thick as the silicon wafers). The PIiS also utilize high-res...