考虑芯片温度分布的IGBT键合线失效退化模型及其寿命预测新方法

Remaining useful lifetime (RUL) prediction for lift-off of bond wires in IGBT modules is essential to avoid strenuous periodic maintenance and electrical accidents of IGBT-based power converters. However, existing model-driven RUL methods mostly focus on lift-off of the first bond wire and rarely consider on-chip temperature distribution, which result in low prediction accuracy. Herein, a novel pr...