平行板多芯片功率模块的蒙特卡洛统计公差分析

A Monte Carlo statistical tolerance analysis is conducted on a parallel-plate, wirebond-less multichip power module (MCPM) to analyze the planarity across modules with post interconnects and identify which parts in the assembly contribute the most variation. Power electronics packaging has migrated from wirebonds to post interconnects that allow for vertical, parallel-plate modules, improving powe...