基于壳温矩阵的IGBT模块多重热退化智能监测

This article presents an intelligent approach for monitoring various thermal degradations in insulated gate bipolar transistor (IGBT) modules. Thermal degradation at the baseplate solder and thermal interface material (TIM) both induce changes in the case temperature distribution, offering insights into the corresponding degradation type and level. To capture this information, a strategically plac...