光伏太阳能电池用硅基片切割技术综述

Abstract With the development of silicon-based photovoltaic (PV) solar cells, there is a growing demand to control the sawing costs of silicon substrates. In this paper, the latest technological developments and research progress of the wafering process for silicon-based PV cell substrates are systematically reviewed. First, two main wafering technologies—loose abrasive wire saw (LAWS) and diamond wire saw (DWS) were introduced. LAWS has been replaced by DWS as DWS has more technical advantages. Then the sawing quality parameters of silicon substrate were discussed, mainly including surface roughness, saw marks, and total thickness variation (TTV). The formation mechanism, experimental measurement, and theoretical research of subsurface microcrack damage (SSD) during the sawing process are then elaborated and discussed. Based on SSD, the fracture strength of silicon substrates is discussed, including experimental testing methods, statistical analysis methods, and progress in numerical modeling. Then, the emerging challenges in the production of industrial large-sized ultra-thin silicon substrates were introduced—the influence of wire capillary adhesion on the sawing process and sawing quality, as well as the impact of silicon substrate capillary adhesion on their fracture probability. Finally, the review outlines future prospects for DWS and proposes key research directions, including process parameter optimization, technology upgrades, and novel coolant development.