通过两个相反方向的散热监测功率模块焊料退化

Solder degradation is still a main failure mechanism for power semiconductor modules. This study proposes a monitoring method to detect the relative change in heat dissipation from a module in two opposing directions, affected by the degradation—upward via the silicone gel and downward via the solder layer to the heatsink. The method is based on external module package measurements, and a conditio...