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电动汽车驱动
★ 5.0
关态常闭型硼掺杂金刚石MOSFET器件击穿电压超过1.7 kV
Normally-off boron-doped diamond MOSFETs with a breakdown voltage over 1.7 kV
| 作者 | |
| 期刊 | Applied Physics Letters |
| 出版日期 | 2025年1月 |
| 卷/期 | 第 127 卷 第 4 期 |
| 技术分类 | 电动汽车驱动 |
| 相关度评分 | ★★★★★ 5.0 / 5.0 |
| 关键词 | 硼掺杂金刚石 MOSFET 常关特性 击穿电压 击穿场强 |
语言:
中文摘要
在150 nm厚的外延层上制备了硼掺杂金刚石(B-diamond)金属-氧化物-半导体场效应晶体管(MOSFET)。测得其阈值电压为-8.0 V,表现出关态常闭特性。由于硼掺杂剂的高电离能及较薄的外延层,B-diamond中形成的空穴数量有限,且可能被Al2O3/B-diamond界面捕获,导致器件呈现常闭行为。该B-diamond MOSFET的绝对击穿电压超过1.7 kV,在栅-漏电极间距为11.3 μm时,计算得到击穿电场达1.52 MV/cm,超过以往同类器件两倍以上。
English Abstract
Boron-doped diamond (B-diamond) metal–oxide–semiconductor field-effect transistors (MOSFETs) are fabricated on a 150 nm-thick epitaxial layer. The threshold voltage of the B-diamond MOSFET is measured at −8.0 V, indicating a normally-off behavior. Due to the high activation energy for the boron dopants and the relatively thin epitaxial layer, a limited number of holes are formed in the B-diamond and potentially trapped within the Al2O3/B-diamond interface, leading to the normally-off behavior observed in the B-diamond MOSFET. The absolute breakdown voltage for the B-diamond MOSFET is found to exceed 1.7 kV. When divided by the gate-to-drain electrode length of 11.3 _μ_ m, the breakdown field is calculated to be 1.52 MV/cm, which is more than two times larger than that of the previous B-diamond MOSFETs.
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SunView 深度解读
该常闭型金刚石MOSFET技术对阳光电源功率器件应用具有前瞻价值。1.7kV击穿电压和1.52MV/cm击穿电场强度显著超越现有SiC器件性能,可应用于ST系列储能变流器和SG系列光伏逆变器的高压功率模块设计。金刚石材料的超宽禁带特性(5.5eV)可实现更高工作温度和更低导通损耗,优化三电平拓扑效率。常闭特性提升系统安全性,适合PowerTitan大型储能系统的故障保护设计。虽然当前技术成熟度有限,但为阳光电源下一代1500V+高压系统和电动汽车驱动模块的功率密度提升提供了技术储备方向,特别是在极端工况下的可靠性提升方面具有战略意义。