真空间隙微带谐振器的制备与表征

In traveling-wave parametric amplifiers (TWPAs), low-loss capacitors are necessary to provide 50 Ω impedance matching to the increased inductance that is brought in by the nonlinear elements used for amplification, be it Josephson junctions or high kinetic inductance materials. Here, we report on the development of a fabrication process for vacuum-gap microstrips, a design in which the ground plane is suspended in close proximity above the center conductor without the support of a dielectric. In addition to high-capacitance transmission lines, this architecture also enables air-bridges and compact parallel-plate capacitors. The performance of the fabrication is examined using distributed aluminum and granular aluminum resonators in a cryogenic dilution refrigerator setup, showing quality factors on par with the fabrication processes used in state-of-the-art TWPAs. In addition to characterizing the dependence of the quality factors on power, also their behavior with respect to temperatu