一种基于SiC器件外部整形模块的高效混合模块化多电平变换器

In order to improve the waveform quality and efficiency of medium voltage modular multilevel converter (MMC), a hybrid MMC (HMMC) topology with an external shaping module is proposed. Each arm of the HMMC consists of N half-bridge submodules (HSMs) based on Si insulated gate bipolar transistor (IGBT), while a full-bridge submodule (FSM) based on silicon carbide (SiC) mosfet on the ac side. Further...