基于金属集成悬置线

In this article, the transmission characteristics of metal integrated suspended line (MISL) technology are studied which is verified by the thru-reflect-line (TRL) de-embedding method. In addition, practical design guidelines for MISL circuits are provided. A 3-D T-junction power-dividing network is introduced. Furthermore, a 3-D Gysel power-dividing network is designed based on the proposed T-junction power-dividing network. Both networks exhibit low-loss performance. They also have a higher power handling capability (PHC) than traditional printed circuit board (PCB). In contrast to waveguide circuits, they utilize multilayer metal stacking, have the characteristics of quasi-planar circuits, and reduce the manufacturing cost. Moreover, compared with the substrate-integrated suspended line (SISL) circuits, the MISL technology reduces the number of circuit layers by combining computer numerical control (CNC) machining with laser and etching technologies, simplifying assembly processes.