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在缩放的毫米波InP/GaInAsSb双异质结双极型晶体管中实现最优的碰撞电离限制击穿电压
Achieving Optimal Impact Ionization-Limited Breakdown Voltages in Scaled mm-Wave InP/GaInAsSb DHBTs
| 作者 | S. Hamzeloui · A. M. Arabhavi · F. Ciabattini · M. Ebrahimi · O. Ostinelli · C. R. Bolognesi |
| 期刊 | IEEE Transactions on Electron Devices |
| 出版日期 | 2025年1月 |
| 技术分类 | 储能系统技术 |
| 技术标签 | 储能系统 |
| 相关度评分 | ★★★★ 4.0 / 5.0 |
| 关键词 | 铟磷/镓铟砷锑双异质结双极晶体管 击穿电压 碰撞电离 带间隧穿 射频输出功率 |
语言:
中文摘要
薄集电极InP/GaInAsSb双异质结双极型晶体管(DHBT)的开基极集电极-发射极击穿电压(BVCEO)和开发射极集电极-基极击穿电压(BVCBO)显著高于相同集电层结构的InP/GaAsSb DHBT,分别提升20%和43%。研究表明,GaInAsSb基区使BVCEO达到由碰撞电离决定的理论极限值,首次在缩放InP DHBT中实现该性能。性能提升源于GaInAsSb抑制了基区价带与InP集电区导带间的带间隧穿。实测与理论计算一致,验证了机制的准确性。该方法无需调整集电区设计即可提升击穿电压,兼顾高频性能,94 GHz大信号测试证实其可显著提高射频输出功率。
English Abstract
Thin collector indium phosphide (InP)/gallium indium arsenide antimonide (GaInAsSb) double heterojunction bipolar transistors (DHBTs) exhibit higher open-base-collector–emitter (BVCEO) and open-emitter-collector–base breakdown (BVCBO) voltages than ternary InP/gallium arsenide antimonide (GaAsSb) DHBTs implemented with identical collector layers: with a GaInAsSb base, BVCEO and BVCBO values are 20% and 43% higher, respectively. The improvement mechanism has not yet been investigated. We show that InP/GaInAsSb DHBTs achieve impact ionization-limited open-base breakdown voltages BVCEO, i.e., the maximum theoretical (and therefore optimal) value for a given InP collector. To date, no other scaled InP DHBTs reach impact ionization limited BVCEO values: GaInAsSb bases thus unlock the full benefits of the high breakdown fields of pure InP collectors. The improved breakdown voltages with GaInAsSb follow from the reduction of interband tunneling between the base valence band and the InP collector conduction band with respect to a GaAsSb base. Measurements on GaAsSb- and GaInAsSb-based devices confirm that only GaInAsSb devices achieve impact ionization limited BVCEO values. The 43% measured improvement in BVCBO with a GaInAsSb base relative to a GaAsSb base is in good quantitative agreement with calculations based on interband tunneling theory. The ability to improve breakdown voltages in “Type-II” DHBTs without modifying the collector design (i.e., doping, thickness, or composition) is unique in bipolar transistors: it helps device designers to maximize transistor output power and power-added efficiency without degrading their cutoff frequencies f_ T / f_ MAX . For GaInAsSb bases, higher RF output power levels enabled by enhanced breakdown voltages are demonstrated in large-signal measurements at 94 GHz.
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SunView 深度解读
该InP/GaInAsSb DHBT击穿电压优化技术对阳光电源功率半导体器件应用具有重要参考价值。研究通过材料能带工程抑制隧穿效应,在不牺牲高频性能前提下提升器件耐压20%-43%,该思路可借鉴至SiC/GaN功率器件优化中。对于ST系列储能变流器和SG系列光伏逆变器,更高击穿电压的功率器件可提升系统耐压等级,支持1500V甚至更高电压平台,降低系统电流和损耗。毫米波大信号射频特性的提升,对充电桩高频开关电源和无线充电技术的功率密度提升有启发意义。该碰撞电离机制的精确建模方法,可应用于功率模块热设计和可靠性仿真优化。