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掺杂分离型隧穿场效应晶体管自对准漏极欠重叠结构变异行为的分析与表征方法
Analysis and Characterization Approach of Variation Behavior for Dopant-Segregated Tunnel FETs With Self-Aligned Drain Underlap
| 作者 | Kaifeng Wang · Qianqian Huang · Ru Huang |
| 期刊 | IEEE Transactions on Electron Devices |
| 出版日期 | 2025年2月 |
| 技术分类 | 电动汽车驱动 |
| 相关度评分 | ★★★★ 4.0 / 5.0 |
| 关键词 | 掺杂隔离隧道场效应晶体管 随机变化源 漏极底部重叠区电长度 器件级表征方法 超低功耗TFET - CMOS混合平台 |
语言:
中文摘要
新型掺杂分凝隧道场效应晶体管(DS - TFET)最近被提出,并在标准互补金属氧化物半导体(CMOS)基线平台上通过实验证明是一种很有前途的低功耗器件。在本文中,为实现大规模生产,我们评估了DS - TFET的变异特性,并仔细研究了其物理机制。与传统隧道场效应晶体管不同,研究发现隧道结的掺杂梯度(TDG)和漏极非重叠区的电气长度(<inline - formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex - math notation="LaTeX">${L}_{\text {und}}$ </tex - math></inline - formula>)是两个主要的随机变异源,并且<inline - formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex - math notation="LaTeX">${L}_{\text {und}}$ </tex - math></inline - formula>的额外变异导致了<inline - formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex - math notation="LaTeX">$\sigma {I}$ </tex - math></inline - formula><sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>和<inline - formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex - math notation="LaTeX">$\sigma {I}$ </tex - math></inline - formula><sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small>之间的不对称变异。基于测量和建模的电流 - 电压(I–V)及电容 - 电压(C–V)特性,我们进一步开发了一种器件级表征方法,用于通过电学手段提取<inline - formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex - math notation="LaTeX">${L}_{\text {und}}$ </tex - math></inline - formula>和主要的变异源,该方法也通过技术计算机辅助设计(TCAD)仿真得到了验证。本文的方法为开发考虑变异的紧凑模型以及基于DS - TFET的电路分析铺平了道路,推动了超低功耗隧道场效应晶体管 - 互补金属氧化物半导体(TFET - CMOS)混合平台的发展。
English Abstract
The novel dopant-segregated tunnel FET (DS-TFET) has recently been proposed and experimentally demonstrated as a promising low-power device on standard CMOS baseline platform. In this article, for high-volume production, we evaluate the variation behavior of DS-TFET and carefully study its physical mechanism. Different from conventional TFET, the doping gradient of tunnel junction (TDG) and the electrical length of drain underlap region ( L_ und ) are found to be the two dominant random variation sources, and the additional variation of L_ und results in the asymmetrical variation between I on and I off. Based on the measured and modeled I–V and C–V characteristics, a device-level characterization approach is further developed to electrically extract L_ und and the main variation sources, which is also verified through technology computer aided design (TCAD) simulation. The method of this work paves the way for the development of the variation-aware compact model and the DS-TFET-based circuit analysis, promoting the development of ultralow-power TFET-CMOS hybrid platform.
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SunView 深度解读
该DS-TFET低功耗器件技术对阳光电源功率电子产品具有重要参考价值。文中提出的变异行为分析方法可应用于SiC/GaN功率器件的工艺一致性评估,特别是ST储能变流器和SG光伏逆变器中的驱动芯片设计。自对准漏极欠重叠结构的工艺参数统计分析方法,可借鉴用于功率模块的制造可靠性评估与良率提升。阈值电压与导通电流的统计分布特性研究,对车载OBC充电机和电机驱动系统中低功耗控制芯片的批量一致性管控具有指导意义,有助于提升产品在宽温度范围下的稳定性与能效表现。