电力电子封装可靠性评估的在线状态监测方法

This article introduces an online condition monitoring strategy that utilizes a transient heat pulse to detect package thermal performance degradation. The metric employed is the temperature-dependent transient thermal impedance “${{Z}}_{\text {{th}}}{(t,{T}_\text {amb})}$.” The proposed methodology offers quantitative insights into package thermal performance degradation and effectively pinpoints...