高热流密度功率半导体器件冷却专利技术综述

The development of wide band-gap power electronics over the last two decades has stimulated a tremendous amount of research into high-performance liquid cooling solutions for high heat flux (200–1000 W/cm$^{2}$) power semiconductor devices. A patent literature search for electronics cooling technologies was conducted in the late-2000 time frame and promising technologies for high-performance therm...