降低高温运行功率器件中烧结银的迁移

Wide-bandgap power devices are usually operated at a higher temperature or larger electrical bias and the harsh conditions often lead to early failure of the widely used Ag-based die-attach materials due to electrochemical migration (ECM). Common methods to mitigate ECM tend to be quite costly and can only enhance the performance slightly under high-temperature conditions. In this letter, novel na...